Title :
A fully integrated 60GHz dual-chip wireless solution for IEEE802.11ad applications (Invited)
Author :
Kaixue Ma;Kiat Seng Yeo;Shouxian Mou;Nagarajan Mahalingam;Yisheng Wang;Bharatha Kumar Thangarasu;Jinna Yan;Wanxin Ye;Keping Wang;Wei Meng Lim;Thin Sek Wong;Yang Lu;Wanlan Yang;Khiam-Boon Png;Francois Chin;Xiaoming Peng;Albert Chai;Zhang Guoping;Chee Piew
Author_Institution :
University of Electronic Science and Technology of China (UESTC), China
Abstract :
This paper presents our developed dual-chip wireless communication solution adhering to the IEEE 802.11ad standards. The solution is based on a fully integrated baseband IC (BBIC) embedded with USB3.0 interfaces and a low power 60 GHz transceiver SOC (RFIC) embedded inside an antenna in packaging system. The BBIC uses frequency domain equalizer and preambles to perform synchronization, automatic gain control, estimation and compensation for better system performance. A low power 60GHz RFIC using a sub-harmonic sliding-IF scheme is fully integrated based on low cost SiGe 0.18 um BiCMOS process.
Keywords :
"Radiofrequency integrated circuits","Transceivers","Packaging","Wireless communication","Standards","Antennas","CMOS integrated circuits"
Conference_Titel :
Microwave Conference (APMC), 2015 Asia-Pacific
Print_ISBN :
978-1-4799-8765-8
DOI :
10.1109/APMC.2015.7411761
