• DocumentCode
    3749870
  • Title

    Attributes of an advanced node cu-barrier slurry

  • Author

    James Schlueter;Maitland Graham;Tim Clore;Mark O´Neill; Brian Cheng Chuan Lee; Chia Chien Lee

  • Author_Institution
    Air Products and Chemicals, Tempe, AZ 85284, USA
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Next generation barrier slurries are required to achieve greater flexibility in materials polished, and tighter process control with improved defectivity and overall cost of ownership. The results of this work demonstrate that chemical additives can be used to increase the efficiency of the mechanical abrasive component of barrier slurries, leading to higher removal rates, improved selectivities, better topographic control, and reduced defects. Air Products´ diverse product offerings in advanced IC integration materials space enables a greater understanding of interactions of chemistry, materials, and integration manufacturing technology, and development of the highest value barrier slurry offerings.
  • Keywords
    "Slurries","Abrasives","Additives","Films","Chemicals","Silicon compounds","Dielectrics"
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2015 International Conference on
  • Type

    conf

  • Filename
    7411948