Application of a novel conditioning platform to a tungsten polishing process

Process robustness in CMP is highly dependent on conditioner performance stability as it drives cut rate and pad roughness, two parameters directly tied to polish rate. Especially in tungsten CMP where both the pad and conditioner are stressed by the relatively high process temperatures and aggressive slurry chemistry, the performance of the pad conditioner is integral to maintaining a stable process. In this paper, we will explore the application of a novel CMP conditioning platform, Pyradia™, to tungsten CMP.