• DocumentCode
    3749904
  • Title

    Challenges of TSV backside process integration

  • Author

    Catharina Rudolph;Holger Wachsmuth;Mathias Boettcher;Wolfram Steller;M. Juergen Wolf

  • Author_Institution
    Fraunhofer IZM-ASSID, Ringstrasse 12, 01468 Moritzburg, Germany
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    New challenges have to be mastered with the introduction of Through Silicon Vias (TSVs) as a key element in 3D integration. This includes also the development and validation of various types of assembly and packaging concepts and methods. The investigations discussed here have been conducted on an interposer for sensor and CMOS devices.
  • Keywords
    "Polymers","Through-silicon vias","Slurries","Three-dimensional displays","Tungsten","Copper","Adhesives"
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2015 International Conference on
  • Type

    conf

  • Filename
    7412002
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3749904