Title :
Challenges of TSV backside process integration
Author :
Catharina Rudolph;Holger Wachsmuth;Mathias Boettcher;Wolfram Steller;M. Juergen Wolf
Author_Institution :
Fraunhofer IZM-ASSID, Ringstrasse 12, 01468 Moritzburg, Germany
Abstract :
New challenges have to be mastered with the introduction of Through Silicon Vias (TSVs) as a key element in 3D integration. This includes also the development and validation of various types of assembly and packaging concepts and methods. The investigations discussed here have been conducted on an interposer for sensor and CMOS devices.
Keywords :
"Polymers","Through-silicon vias","Slurries","Three-dimensional displays","Tungsten","Copper","Adhesives"
Conference_Titel :
Planarization/CMP Technology (ICPT), 2015 International Conference on
