• DocumentCode
    3749918
  • Title

    Investigation on cu height process control method in BEOL Cu CMP

  • Author

    Ji Chul Yang;Daniel Scheffler;Gerett Yocum;Jason Mazzotti;Mark Dougherty

  • Author_Institution
    CMP Team, Advanced Module Engineering, GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY 12020, USA
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    CMP APC is well-known technology in mass manufacturing site. But each fabrication´s different device and environmental request for Engineers to takes lots of experimental time to apply for it in real process flows. In this paper, up-to-date APC application method was introduced such as in-situ CLC profile, barrier polishing time APC and dielectric measurement control method in barrier CMP. In device, 20% level of wafer-to-wafer and resistance value was improved using optimized process conditions.
  • Keywords
    "Process control","Time measurement","Monitoring","Manufacturing","Area measurement","Thickness measurement","Optical sensors"
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2015 International Conference on
  • Type

    conf

  • Filename
    7412016
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3749918