Title :
Yield improvement through improved uniformity via application of multi-zone polish head for STI-CMP
Author :
Benno Milmore;Scott Wills; Yanmei Xing; Mike Liu
Author_Institution :
Process Engineering, Microchip Technology Inc., Gresham, USA
Abstract :
Application of a multi-zone polish head was used to develop a new STI-CMP process. Resulting uniformity improvements demonstrated by post CMP and Active Nitride removal metrology have resulted in a robust STI-CMP process with improved yield on 0.25μm technology.
Conference_Titel :
Planarization/CMP Technology (ICPT), 2015 International Conference on
