• DocumentCode
    3750172
  • Title

    Application of laser Doppler Vibrometer for wire bond capillary quality evaluation

  • Author

    Yang Kai;Ong Chen Ho;Alfred Yeo

  • Author_Institution
    Infineon Technologies Asia Pacific Pte Ltd, 168, Kallang Way, Singapore 349253
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Incoming wire bond capillary quality is critical for wire bond result consistency on production lines. The inconsistent capillary quality can cause abnormal capillary tip vibration distribution when ultrasonic power is applied. In this paper, a new non-destructive method of capillary quality evaluation using Laser Doppler Vibrometer and wire bonder has been proposed. The high-risk capillaries with vibration anomaly can be screened out using this method, which will help to improve the wire bonding yield on the production line.
  • Keywords
    "Electronics packaging","Decision support systems","Hafnium"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412276
  • Filename
    7412276