Title :
Application of laser Doppler Vibrometer for wire bond capillary quality evaluation
Author :
Yang Kai;Ong Chen Ho;Alfred Yeo
Author_Institution :
Infineon Technologies Asia Pacific Pte Ltd, 168, Kallang Way, Singapore 349253
Abstract :
Incoming wire bond capillary quality is critical for wire bond result consistency on production lines. The inconsistent capillary quality can cause abnormal capillary tip vibration distribution when ultrasonic power is applied. In this paper, a new non-destructive method of capillary quality evaluation using Laser Doppler Vibrometer and wire bonder has been proposed. The high-risk capillaries with vibration anomaly can be screened out using this method, which will help to improve the wire bonding yield on the production line.
Keywords :
"Electronics packaging","Decision support systems","Hafnium"
Conference_Titel :
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
DOI :
10.1109/EPTC.2015.7412276