DocumentCode
375018
Title
Increase in EMI of module connectors due to the presence of intervening geometry
Author
Haussmann, Gary
Author_Institution
Sanmina Corp., San Jose, CA, USA
Volume
1
fYear
2001
fDate
2001
Firstpage
635
Abstract
This paper examines the EMI effect of intervening geometry inside an electronics enclosure. Often, when examining the EMI ramifications of a modules-on-backplane enclosure, one examines the geometry of the backplane and PCB modules. However, the physical proximity of conductors such as stiffeners, partitions, and brackets can affect the emissions of the overall enclosure. This specific condition is examined using both a full-wave electromagnetics simulation and measurement of a simple enclosure
Keywords
conductors (electric); electric connectors; electromagnetic interference; modules; packaging; printed circuits; EMI effect; PCB modules; backplane; brackets; conductors; electronics enclosure geometry; fullwave electromagnetics measurement; fullwave electromagnetics simulation; modules-on-backplane enclosure; partitions; stiffeners; Backplanes; Conductors; Connectors; Electromagnetic interference; Electromagnetic radiation; Electromagnetic scattering; Geometry; Joining processes; Routing; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
Conference_Location
Montreal, Que.
Print_ISBN
0-7803-6569-0
Type
conf
DOI
10.1109/ISEMC.2001.950719
Filename
950719
Link To Document