DocumentCode :
3750191
Title :
Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows
Author :
Yong Han;Boon Long Lau;Gongyue Tang;Xiaowu Zhang
Author_Institution :
Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685
fYear :
2015
Firstpage :
1
Lastpage :
5
Abstract :
A micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows is developed for the thermal management of electron devices with high power density. Several structures have been designed, which will enable high heat dissipation capability, even temperature distribution and low driving pressure/electric field. This thermal solution shows enhanced cooling capability not only in dissipating the uniform heat flux but also in diminishing the localized hot spots for the electric devices. For the new heat sink structure of larger hydraulic diameter with pressure-driven flow, the thermal resistance can be decreased by 65% compared with the regular structure. With the same operating flow rate, the proposed structure enables 80% decrease of the pressure drop in addition to about 25% improvement of the thermal resistance. For the new structure of smaller hydraulic diameter with electro-osmotic flow, the thermal resistance is highly reduced, and about 45% improvement can be obtained. With the same flow rate, the electric voltage can be decreased by about 50%. More even temperature distribution can be obtained by using the new heat sink for hot spots cooling.
Keywords :
"Heat sinks","Resistance heating","Thermal resistance","Temperature distribution"
Publisher :
ieee
Conference_Titel :
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
Type :
conf
DOI :
10.1109/EPTC.2015.7412295
Filename :
7412295
Link To Document :
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