Title :
Miniaturization of bio-fluidic package for point-of-care diagnostic
Author :
Hwang How Yuan;Lee Tae Yoon;Ding Mian Zhi;Chung Jaehoon;Daniel Rhee Minwoo
Author_Institution :
Institute of Microelectronics, A?STAR (Agency for Science, Technology and Research), 11 Science Park Road, Science Park II, Singapore - 117685
Abstract :
This paper introduces a new packaging concept that allows miniaturization of bio-fluidic package for micro and nanoparticle separation through dielectrophoresis (DEP). Leaf-shaped spacers were patterned at wafer level using a developmental bio-compatible photoresist through lithography processes, allowing better control of spacer profile and thickness. Interconnects were formed on ITO-coated glass and then flip-chip bonded onto the patterned die. The developed test vehicle, measured 5mm × 5mm, has 9216 electrodes arranged within a total sensor area of 3 mm × 3 mm. Experiments using colloids showed that the test vehicle is able to trap the 15μm suspended beads onto the electrodes.
Keywords :
"Bonding","Glass","CMOS integrated circuits","Electrodes","Force","Lithography","Electric fields"
Conference_Titel :
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
DOI :
10.1109/EPTC.2015.7412296