Compact thermal modelling of packages containing multiple devices

This paper discusses the problem of using compact thermal models for analysis of packages containing multiple devices. In such cases, the devices influence each other hence in order to predict accurately the temperature of a device it is necessary not only to generate compact models for individual devices, which would reflect their self-heating, but also additional ones describing mutual heating effects. This problem is illustrated on the practical example of a package containing twin power diodes. The compact thermal models generated in different cooling conditions are validated with measurements of diode dynamic temperature responses.