DocumentCode
3750289
Title
Investigation of vertical interposers for high frequency operation
Author
Wei Yi Lim;Ka Fai Chang;M. Kumarasamy Raja;Seow Meng Low;Jason Goh;M. Annamalai Arasu
Author_Institution
Institute of Microelectronics, Agency for Science, Technology and Research (A?Star), 11 Science park Road, Singapore Science Park II, Singapore 117685
fYear
2015
Firstpage
1
Lastpage
4
Abstract
Horizontal probe station poses challenges in determining performance of vertical interposers for test socket. In this paper, a PCB test structure has been proposed for measurement of our designed interposers up to 20 GHz. A new test structure is further proposed and simulated with HFSS to achieve a higher operating frequency. By converting the S-parameters of test structures to T-parameters and splitting of cascaded blocks using optimization method, the performance of an individual vertical interposer can be obtained.
Keywords
"Scattering parameters","Probes","Optimization methods","Periodic structures","Sockets","Electronics packaging","Frequency measurement"
Publisher
ieee
Conference_Titel
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
Type
conf
DOI
10.1109/EPTC.2015.7412393
Filename
7412393
Link To Document