DocumentCode
3750293
Title
Deflashing design rules and its impact towards package quality
Author
Jagen Krishnan;Ong Luay Kuan
Author_Institution
Infineon Technologies, Free Trade Zone, Batu Berendam, 75350 Malacca
fYear
2015
Firstpage
1
Lastpage
4
Abstract
In semiconductor industry, deflashing is one of the important process steps during manufacturing of the semiconductor product. The term `deflashing´ is used to describe the removal of excessive mold bleed and resin bleed as a result of molding process in the assembly of the plastic devices as shown in figure 1. Mold bleed is black color material and is due to leakage while resin bleed is transparent / light yellowish-brown color and is due to separation of the epoxy resin from the fillers.
Keywords
"Chemicals","Media","Lead","Plating","Resins","Electronics industry","Electronics packaging"
Publisher
ieee
Conference_Titel
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
Type
conf
DOI
10.1109/EPTC.2015.7412411
Filename
7412411
Link To Document