Title : 
Deflashing design rules and its impact towards package quality
         
        
            Author : 
Jagen Krishnan;Ong Luay Kuan
         
        
            Author_Institution : 
Infineon Technologies, Free Trade Zone, Batu Berendam, 75350 Malacca
         
        
        
        
        
            Abstract : 
In semiconductor industry, deflashing is one of the important process steps during manufacturing of the semiconductor product. The term `deflashing´ is used to describe the removal of excessive mold bleed and resin bleed as a result of molding process in the assembly of the plastic devices as shown in figure 1. Mold bleed is black color material and is due to leakage while resin bleed is transparent / light yellowish-brown color and is due to separation of the epoxy resin from the fillers.
         
        
            Keywords : 
"Chemicals","Media","Lead","Plating","Resins","Electronics industry","Electronics packaging"
         
        
        
            Conference_Titel : 
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
         
        
        
            DOI : 
10.1109/EPTC.2015.7412411