Modeling and crosstalk analysis of mixed conventional and coaxial TSVs network

This paper presents a methodology to characterize the electrical behaviors of mixed conventional and coaxial through silicon vias (TSVs) network in three-dimensional (3-D) integrated circuits. An equivalent circuit model is established to predict the insertion loss and crosstalk level of the mixed TSV network. By the proposed model, the shielding effectiveness of the outer conductor in coaxial TSV is evaluated. And the crosstalk due to the bumps connecting TSVs in stacked chips is also analyzed. The results by the proposed model are verified against the full-wave simulator up to 40 GHz.