Title :
Electrical-thermal co-simulation for large-scale analysis of integrated circuits
Author :
Tianjian Lu;Jian-Ming Jin
Author_Institution :
Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, U.S.A
Abstract :
An electrical-thermal co-simulation is presented for analysis of integrated circuits. The co-simulation addresses a wide range of situations where strong interactions between electrical designs and thermal issues have to be properly accounted. The capability of the co-simulation is extended to deal with large-scale problems by incorporating a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme. Numerical examples are provided to demonstrate the capability and efficiency of the co-simulation.
Keywords :
"Mathematical model","Bonding","Wires","Finite element analysis","Heating","Integrated circuits","Thermal analysis"
Conference_Titel :
Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2015 IEEE MTT-S International Conference on
DOI :
10.1109/NEMO.2015.7415091