DocumentCode
375723
Title
Numerical investigation of vertical contactless transitions for multilayer RF circuits
Author
Moretti, P. ; Starski, J.P. ; Svensson, B.I. ; Manholm, L.
Author_Institution
Ericsson Microwave Syst., Molndal, Sweden
Volume
2
fYear
2001
fDate
20-24 May 2001
Firstpage
1371
Abstract
This paper presents some concepts for contactless transitions between different planar transmission lines. These types of transitions are important for use in e.g. multilayer designs. Another important reason to avoid galvanic connections at RF is that they may generate passive intermodulation products (PIM), which can be a serious problem in multifrequency systems. The investigated transitions operate in the extended GSM 900 band (880-960 MHz).
Keywords
intermodulation; strip line transitions; transmission line theory; 880 to 960 MHz; GSM 900 band; multifrequency system; multilayer RF circuit; numerical model; passive intermodulation product; planar transmission line; vertical contactless transition; Circuit optimization; Conductors; Coupling circuits; GSM; Impedance; Manufacturing; Microstrip; Nonhomogeneous media; Radio frequency; Stripline;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location
Phoenix, AZ, USA
ISSN
0149-645X
Print_ISBN
0-7803-6538-0
Type
conf
DOI
10.1109/MWSYM.2001.967151
Filename
967151
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