DocumentCode :
375846
Title :
157 nm-248 nm multiwavelength excitation processing for application in optoelectronic manufacturing
Author :
Obata, K. ; Sugioka, K. ; Akane, T. ; Aoki, N. ; Toyoda, K. ; Midorikawa, K.
Author_Institution :
RIKEN, Inst. of Phys. & Chem. Res., Saitama, Japan
Volume :
1
fYear :
2001
fDate :
15-19 July 2001
Abstract :
Simultaneous irradiation of F/sub 2/ and KrF excimer lasers was demonstrated for high-quality ablation and photo-sensitivity of fused silica. Micropatterns were formed on fused silica by both the etching and the refractive index modification with little surface damage.
Keywords :
etching; excimer lasers; laser ablation; laser materials processing; micro-optics; optical fabrication; refractive index; silicon compounds; 157 to 248 nm; F/sub 2/; F/sub 2/ excimer lasers; KrF; KrF excimer lasers; SiO/sub 2/; etching; fused silica; high-quality ablation; micropatterns; multiwavelength excitation processing; optoelectronic manufacturing; photo-sensitivity; refractive index modification; simultaneous irradiation; surface damage; Chemical industry; Chemical technology; Gas lasers; Laser ablation; Laser beams; Laser excitation; Manufacturing processes; Mirrors; Silicon compounds; Toy manufacturing industry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics, 2001. CLEO/Pacific Rim 2001. The 4th Pacific Rim Conference on
Conference_Location :
Chiba, Japan
Print_ISBN :
0-7803-6738-3
Type :
conf
DOI :
10.1109/CLEOPR.2001.967844
Filename :
967844
Link To Document :
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