• DocumentCode
    376019
  • Title

    Photonic ChipTM platform for communication applications

  • Author

    Feldman, Michael R.

  • Author_Institution
    Digital Opt. Corp., Charlotte, NC, USA
  • Volume
    2
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    497
  • Abstract
    At Digital Optics, we have been developing a platform for integration based on free-space propagation, termed Photonic Chips. With this platform, all passive components are made at the wafer level. Multiple wafers are aligned and assembled and subsequently diced to form hundreds or thousands of devices simultaneously
  • Keywords
    integrated circuit technology; integrated optoelectronics; optical communication equipment; free-space propagation; monolithic integration; multiple wafer alignment; optical communication applications; passive components; photonic chip platform; wafer level; Assembly systems; Costs; Electronic equipment manufacture; Integrated optics; Optical attenuators; Optical devices; Optical fiber devices; Optical filters; Optical waveguides; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-7105-4
  • Type

    conf

  • DOI
    10.1109/LEOS.2001.968890
  • Filename
    968890
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=376019