• DocumentCode
    3762875
  • Title

    A SWOT analysis of TSV: Strengths, weaknesses, opportunities, and threats

  • Author

    Khaled Salah

  • Author_Institution
    Mentor Graphics, Cairo, Egypt
  • fYear
    2015
  • Firstpage
    214
  • Lastpage
    217
  • Abstract
    SWOT analysis is one of the most powerful analysis techniques. It is useful in exploring possibilities for new efforts or solutions to problems and making decisions about the best path. In this paper, SWOT analysis for TSV assessment is presented. The aim of this work is to analyze TSV-Based 3D integration from various perspectives and to determine its strengths, weaknesses, opportunities and threats.
  • Keywords
    "Three-dimensional displays","Integrated circuit interconnections","Through-silicon vias","Design automation","Couplings","Integrated circuit modeling"
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (ICM), 2015 27th International Conference on
  • Electronic_ISBN
    2159-1679
  • Type

    conf

  • DOI
    10.1109/ICM.2015.7438026
  • Filename
    7438026
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3762875