Title :
A SWOT analysis of TSV: Strengths, weaknesses, opportunities, and threats
Author_Institution :
Mentor Graphics, Cairo, Egypt
Abstract :
SWOT analysis is one of the most powerful analysis techniques. It is useful in exploring possibilities for new efforts or solutions to problems and making decisions about the best path. In this paper, SWOT analysis for TSV assessment is presented. The aim of this work is to analyze TSV-Based 3D integration from various perspectives and to determine its strengths, weaknesses, opportunities and threats.
Keywords :
"Three-dimensional displays","Integrated circuit interconnections","Through-silicon vias","Design automation","Couplings","Integrated circuit modeling"
Conference_Titel :
Microelectronics (ICM), 2015 27th International Conference on
Electronic_ISBN :
2159-1679
DOI :
10.1109/ICM.2015.7438026
