• DocumentCode
    3767987
  • Title

    Effect of direct fluorination on surface potential behavior of polyimide film under low temperature

  • Author

    Bo Xue Du;Yun Qi Xing;Jian Xun Jin;Li Jin;Ji Wei Zhang;Meng Xiao;Xue Qiao Zhang

  • Author_Institution
    School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072, China
  • fYear
    2015
  • Firstpage
    270
  • Lastpage
    271
  • Abstract
    Polyimide film has been used as an insulation material in the excitation winding of the high temperature superconducting motors. The existence of surface charge has a great influence on the breakdown characteristic. Direct fluorination is an effective method of polymers surface modification which can improve the electrical properties of original material. Therefore, it is necessary that the surface potential behaviors of fluorinated polyimide films under low temperature were studied to clarify the effects of fluorination time and low temperature. Polyimide specimens were fluorinated in a reaction kettle at 55 °C using a F2/N2 blend with volume fraction of 80% nitrogen and 0.05 MPa for 15, 30, 45 and 60 min, respectively. The specimens without fluorination were also prepared for reference. Corona charging was performed with pulse voltage at a relative humidity of ~ 11% in atmospheric air. Then the specimens were cooled by liquid nitrogen in 10 s before and after corona charging. The surface potential was measured by the device of an electrostatic voltmeter. The experimental results indicate that the behaviors of surface potential in the surface of polyimide films are affected by the charge polarity, specimen temperature and fluorination time.
  • Keywords
    "Surface charging","Films","Electric potential","Temperature measurement","Insulation","High-temperature superconductors","Temperature"
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2015 IEEE International Conference on
  • Print_ISBN
    978-1-4673-8106-2
  • Type

    conf

  • DOI
    10.1109/ASEMD.2015.7453568
  • Filename
    7453568