Broadband transition structures using LCP packaging technology

In this paper two types of broadband transition structures have been developed up to V-band. They are based on advanced implementations of the surface mount interconnect referred to as vertical via transitions and Land-Grid-Array (LGA) technology [1]. These structures have been based on liquid crystal polymer (LCP) multilayer technology, which is an organic low-cost substrate with excellent dielectric material properties (low loss and dispersion). The simulation and optimization are carried out by a full wave EM simulator. Finally, the simulation results of the back-to-back structures show that the vertical via transition works well from DC to 70GHz, the return loss is better than 20 dB, the insertion loss is less than 0.7 dB, and the LGA transition has good performance up to 60 GHz, the insertion loss of this type is 2.1 dB at 60GHz, the return loss is more than 20dB, respectively.