DocumentCode :
3769699
Title :
New developments and trends in resins for electronic packaging
Author :
Max M. Lee;D. F. Christensen;M. E. Nelson;R. L. Spraetz
Author_Institution :
Leepoxy Plastics, Fort Wayne, Indiana
fYear :
1962
Firstpage :
147
Lastpage :
150
Abstract :
If we could project ourselves into the future, say twenty or thirty centuries from now, and then look back, we would realize that the 20th century was outstanding not because it gave birth to the atomic age or the space age but mainly because of the development and growth of research and development, and especially applied research and development. That is, atomic energy and the conquering of space as well as many other great achievements were merely the result of organized research and development. Correspondingly, new developments and trends in resins for electronic packaging and their processing techniques and equipment are also the results of research and development. As research and development continues to expand, we have an ever increasing choice of new materials, processes and processing equipment.
Keywords :
"Resins","Market research","Thermal stability","Electronics packaging","Temperature","Resistance","Casting"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference Materials and Application, 1962. EIC 1962. EI
Print_ISBN :
978-1-5090-3103-0
Type :
conf
DOI :
10.1109/EIC.1962.7456068
Filename :
7456068
Link To Document :
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