DocumentCode :
3769701
Title :
Improved electrical properties of electronic packaging based on epoxypolybutadiene resin
Author :
Christian W. Johnston;Donald F. Stackhouse
Author_Institution :
FMC Corporation, P. O. Box 8, Princeton, New Jersey
fYear :
1962
Firstpage :
154
Lastpage :
156
Abstract :
In the past year a new class of epoxy resins has come onto the market. These resins which go under the name of Oxiron® are epoxidized polybutadienes. In addition to having the oxirane oxygen groups, they also possess unsaturation and therefore the methods of curing them can be quite diverse. The great versatility of this resin has been discussed in previous papers(1, 2, 3, 4) as well as its application to specific end uses such as laminates(5). At the present time we propose discussing the use of these resins for electronic packaging.
Keywords :
"Compounds","Resins","Frequency measurement","Resistance","Q measurement","Temperature","Heating"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference Materials and Application, 1962. EIC 1962. EI
Print_ISBN :
978-1-5090-3103-0
Type :
conf
DOI :
10.1109/EIC.1962.7456070
Filename :
7456070
Link To Document :
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