Title :
Polyimide materials evaluation
Author_Institution :
IBM Corp. Federal Systems Division, Owego, New York 13827, USA
Abstract :
Addition cure polyimide materials made from Kerimid 601 resin are easily fabricated into multilayer boards using processes and equipment normally intended for epoxy boards.
Keywords :
"Glass","Polyimides","Laminates","Copper","Nonhomogeneous media","Resins","Resists"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1975 EIC 12th
Print_ISBN :
978-1-5090-3111-5
DOI :
10.1109/EIC.1975.7458478
