Title :
Reliability considerations in the application of plastic semiconductors
Author_Institution :
U. S. Army Electronics Command, Electronic Technology and Devices Laboratory, Fort Monmouth, New Jersey 07703, USA
Abstract :
Extensive reliability evaluation of plastic encapsulated transistors and microcircuits at Fort Monmouth and by vendors and commercial users of these devices, has revealed at least three major problem areas: 1. Bond Integrity 2. Moisture Resistance 3. Salt Atmosphere Sensitivity
Keywords :
"Plastics","Transistors","Integrated circuit reliability","Semiconductor diodes","Gold"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1975 EIC 12th
Print_ISBN :
978-1-5090-3111-5
DOI :
10.1109/EIC.1975.7458493
