• DocumentCode
    3770492
  • Title

    An overview of silicone dielectric gels

  • Author

    Daryl D. Dickson

  • Author_Institution
    Dow Corning Corporation, Midland, Michigan, USA
  • fYear
    1975
  • Firstpage
    92
  • Lastpage
    95
  • Abstract
    Although silicone dielectric gels have been employed in microcircuit packaging applications for more than a decade, there has been a lack of information in the literature to aid a potential user. This report provides an overview of how silicone dielectric gels are used, with special emphasis on quality control test procedures and cure system limitations.
  • Keywords
    "Dielectrics","Rubber","Substrates","Resins","Heating","Chemicals","Production"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1975 EIC 12th
  • Print_ISBN
    978-1-5090-3111-5
  • Type

    conf

  • DOI
    10.1109/EIC.1975.7458502
  • Filename
    7458502
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3770492