• DocumentCode
    3771017
  • Title

    The High-Rel plastic package versus transfer molded encapsulation

  • Author

    Randall D. Clark;Paul E. Smith

  • Author_Institution
    U.S. Electronic Service, USA
  • fYear
    1971
  • Firstpage
    68
  • Lastpage
    69
  • Abstract
    The USES High-ReI hermetic metallized plastic package offers distinct advantages over the conventional transfer molded package. The key points of merit have been covered in detail and are listed below.
  • Keywords
    "Plastics","Lead","Ceramics","Wires","Moisture","Gold","Cavity resonators"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1971 EIC 10th
  • Print_ISBN
    978-1-5090-3116-0
  • Type

    conf

  • DOI
    10.1109/EIC.1971.7460772
  • Filename
    7460772
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3771017