Title :
The High-Rel plastic package versus transfer molded encapsulation
Author :
Randall D. Clark;Paul E. Smith
Author_Institution :
U.S. Electronic Service, USA
Abstract :
The USES High-ReI hermetic metallized plastic package offers distinct advantages over the conventional transfer molded package. The key points of merit have been covered in detail and are listed below.
Keywords :
"Plastics","Lead","Ceramics","Wires","Moisture","Gold","Cavity resonators"
Conference_Titel :
Electrical Insulation Conference, 1971 EIC 10th
Print_ISBN :
978-1-5090-3116-0
DOI :
10.1109/EIC.1971.7460772
