DocumentCode :
3771139
Title :
Resin thermal analysis
Author :
R. K. Khattak;E. E. Woods
Author_Institution :
Westinghouse Electric Corporation, 469 Sharpsville Avenue, Sharon, Pennsylvania 16146, USA
fYear :
1979
Firstpage :
123
Lastpage :
127
Abstract :
Thermomechanical Analysis Technology was used as a means of establishing a molding cycle for the manufacture of resin insulated bushings. The degree of cure of the resin system used in the molding process was found to be significantly different when heated vs unheated conductors were used. The glass transition temperature (Tg) was used to determine the degree of cure of the resin system and the coefficient of thermal expansion (?) of the resin was used as a guideline for choosing the appropriate molding cycle time best suited for economical production of the molded bushings.
Keywords :
"Conductors","Insulators","Heating","Glass","Thermomechanical processes","Epoxy resins"
Publisher :
ieee
Conference_Titel :
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN :
978-1-5090-3113-9
Type :
conf
DOI :
10.1109/EIC.1979.7461102
Filename :
7461102
Link To Document :
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