DocumentCode :
3771141
Title :
New heat resistant solventless varnish ?10 resin? (part II)
Author :
Noriyuki Kinjo;Toru Koyama;Toshikazu Narahara;Junji Mukai
Author_Institution :
Hitachi Research Laboratory, Hitachi Ltd., 4026 Kuji-cho, Hitachi-shi, Ibaraki-ken, Japan
fYear :
1979
Firstpage :
129
Lastpage :
132
Abstract :
The research and development of organic heat resistant materials has made a great progress especially in the field of solvent type varnishes. For example, polyimide, polybenzimidazole, polydiphenylether, and silicone have been developed so far. However, solventless varnishes that can resist high temperatures have not been developed yet, because it is very difficult to give high temperature heat resistant properties to cured resins which have a low viscosity before curing. Epoxy resins are now widely used as solventless varnishes, however, they cannot be used at temperatures above 180?C.
Keywords :
"Temperature","Heating","Epoxy resins","Viscosity","Thermal stability"
Publisher :
ieee
Conference_Titel :
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN :
978-1-5090-3113-9
Type :
conf
DOI :
10.1109/EIC.1979.7461104
Filename :
7461104
Link To Document :
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