DocumentCode :
3771166
Title :
Non-PCB capacitor technology trends
Author :
Frank D. Price
Author_Institution :
General Electric Capacitor Products Department, Hudson Falls, N.Y. 12839, USA
fYear :
1979
Firstpage :
243
Lastpage :
245
Abstract :
After four decades of product design based on a single dielectric liquid, the introduction of non-PCB fluids in 1977 has opened the design limits, economics, and materials for the capacitor design engineer. This paper reviews three major technology changes that are taking place in the capacitor industry involving the use of polypropylene film dielectrics and either vacuum deposited metal or embossed foil electrodes. The significant reduction in energy cost using these new technologies is demonstrated.
Keywords :
"Capacitors","Films","Electrodes","Economics","Fluids","Dielectric losses"
Publisher :
ieee
Conference_Titel :
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN :
978-1-5090-3113-9
Type :
conf
DOI :
10.1109/EIC.1979.7461129
Filename :
7461129
Link To Document :
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