Title :
Epoxy resins for molding application
Author :
D. Helfand;T. Villani
Author_Institution :
CIBA-GEIGY Corporation, USA
Abstract :
Epoxy resins offer many advantages over other resin types for the encapsulation of active semi conductor devices. Of particular importance in this area are the epoxy cresol novolacs.
Keywords :
"Compounds","Epoxy resins","Solids","Manganese","Chromatic dispersion","Thermal conductivity"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN :
978-1-5090-3113-9
DOI :
10.1109/EIC.1979.7461139
