• DocumentCode
    3771177
  • Title

    Transfer molding high-voltage transformers on lead frames improves reliability, economy and design flexibility

  • Author

    B. Cogan;T. Morisky

  • Author_Institution
    Tektronix, Inc., P. O. Box 500, Beaverton, OR. 97077, USA
  • fYear
    1979
  • Firstpage
    298
  • Lastpage
    302
  • Abstract
    It has been shown that lead frame technology, successfully utilized with integrated circuits, is very adaptable to different and larger components. Reliability is improved and costs are reduced. Design flexibility is enhanced with simpler, easily adaptable mechanical packaging.
  • Keywords
    "Lead","Transfer molding","Reliability","Humidity","Standards","Encapsulation"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1979 EIC 14th
  • Print_ISBN
    978-1-5090-3113-9
  • Type

    conf

  • DOI
    10.1109/EIC.1979.7461140
  • Filename
    7461140
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3771177