Title :
Transfer molding high-voltage transformers on lead frames improves reliability, economy and design flexibility
Author :
B. Cogan;T. Morisky
Author_Institution :
Tektronix, Inc., P. O. Box 500, Beaverton, OR. 97077, USA
Abstract :
It has been shown that lead frame technology, successfully utilized with integrated circuits, is very adaptable to different and larger components. Reliability is improved and costs are reduced. Design flexibility is enhanced with simpler, easily adaptable mechanical packaging.
Keywords :
"Lead","Transfer molding","Reliability","Humidity","Standards","Encapsulation"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN :
978-1-5090-3113-9
DOI :
10.1109/EIC.1979.7461140
