Title :
Silicone insulation improves aerospace electronic high-voltage power supply MTBF
Author_Institution :
Boeing Aerospace Company, Seattle, Washington, USA
Abstract :
A lightweight, small-volume, electronic high-voltage power supply has been verified to have improved life characteristic when encapsulated with Silicone E rather than epoxy. High-failure-rate modules and two assembled power supplies were subjected to accelerated-life, thermal shock, altitude, and vibration tests to prove that Silastic E was a superior encapsulation medium.
Keywords :
"Power supplies","Insulation","Stress","Power transformer insulation","Packaging","Soldering","Life estimation"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN :
978-1-5090-3113-9
DOI :
10.1109/EIC.1979.7461141
