DocumentCode
3771179
Title
Structural effects of encapsulated components on internal stresses in epoxy resin castings
Author
M. Kitoh;H. Yokono;N. Shibata;K. Suzuki
Author_Institution
Production Engineering Research Laboratory, Hitachi Limited, (292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Japan)
fYear
1979
Firstpage
308
Lastpage
311
Abstract
The internal stresses produced in three cylinder models simulating the structures of many epoxy resin encapsulated components were measured by strain gauge. The mechanism of stress generation is very different between an open type structure that has one surface of the resin open, and a closed type that does not. Internal stresses of an open type structure are essentially produced by the thermal contraction below the Tg of the epoxy resin, which agrees with other workers. 1) 3) However, stresses of a closed type structure are produced by various volume changes after gelation of the epoxy resin. In particular, large stresses are produced by chemical contraction after gelation and thermal contraction above the Tg of the epoxy resin. These stresses cause the generation of cracks and peeling in epoxy casting components.
Keywords
"Stress","Cooling","Strain","Epoxy resins","Curing","Thermal stresses"
Publisher
ieee
Conference_Titel
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN
978-1-5090-3113-9
Type
conf
DOI
10.1109/EIC.1979.7461142
Filename
7461142
Link To Document