Advances and trends in electronic encapsulation

In less than 20 years the encapsulation of electronic components and circuits has developed from a laboratory tool to a high production operation. Considerable advances have been made, and will continue to be made, in materials, processes, processing technique, equipment, industry know-how. and design. Many problems have been solved, but many still remain. These include: exotherm, shrinkage, thermal shock, thermal conductivity, incompatibility, and the effect of encapsulation on electrical parameters of the circuit. Encapsulation by transfer molding has in less than 7 years developed as the fastest growing area. The potting of transformers with casting resins is developing into a large volume business.