DocumentCode :
3771232
Title :
Dielectrics in micro-circuitry for communications
Author :
M. Tenzer
Author_Institution :
U. S. Army Electranics Laboratories, Fort Monmouth, New Jersey, USA
fYear :
1965
Firstpage :
110
Lastpage :
113
Abstract :
A little over a decade ago, two technologies emerged from the laboratories which were to have a profound impact on the military communications and electronics equipments of today. First, pre-fabricated wiring introduced an orderly geometrical discipline, automation of inter-connections and modular subassemblies within equipments. Secondly, the transistor permitted the design of many circuits with marked reduction in size, power requirements, operating voltages and temperature rise. Figure 1 illustrates a typical application to circuitry from a telemetry deck of one of the early ?Explorer? Satellites. Here fullest use is made of printed wiring and transistors as well as special subminiature passive components scaled down for compatibility with transistor characteristics. This low power digital circuit contains solid tantalum capacitors, multilayer high K ceramic capacitors, 0.1 watt fixed resistors, and glass packaged diodes. Higher power levels and tuned circuits require the use of miniature foil capacitors and stable film resistors.
Keywords :
"Films","Transistors","Wiring","Glass","Capacitors","Resistors","Printed circuits"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1965 Sixth
Print_ISBN :
978-1-5090-3105-4
Type :
conf
DOI :
10.1109/EIC.1965.7461197
Filename :
7461197
Link To Document :
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