DocumentCode :
3771236
Title :
Materials and process for multilayer circuits
Author :
L. V. Larsen
Author_Institution :
General Electric Co., Coshocton, Ohio, USA
fYear :
1965
Firstpage :
121
Lastpage :
124
Abstract :
Although they have been in use only a few years, multilayer circuits have found a place of great importance in electronic packaging because they uniquely fill a need. Perhaps in their beginning, multilayer circuits were thought of as a convenient answer to the requirements for making connections into and within compact circuits, but today they are finding application as circuit components themselves.
Keywords :
"Laminates","Nonhomogeneous media","Copper","Glass","Bonding","Standards","Resins"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1965 Sixth
Print_ISBN :
978-1-5090-3105-4
Type :
conf
DOI :
10.1109/EIC.1965.7461201
Filename :
7461201
Link To Document :
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