Title :
Materials and process for multilayer circuits
Author_Institution :
General Electric Co., Coshocton, Ohio, USA
Abstract :
Although they have been in use only a few years, multilayer circuits have found a place of great importance in electronic packaging because they uniquely fill a need. Perhaps in their beginning, multilayer circuits were thought of as a convenient answer to the requirements for making connections into and within compact circuits, but today they are finding application as circuit components themselves.
Keywords :
"Laminates","Nonhomogeneous media","Copper","Glass","Bonding","Standards","Resins"
Conference_Titel :
Electrical Insulation Conference, 1965 Sixth
Print_ISBN :
978-1-5090-3105-4
DOI :
10.1109/EIC.1965.7461201