DocumentCode :
3771258
Title :
An epoxy-paper insulation system for high voltage applications
Author :
G. R. Atkinson;W. R. Thomas
Author_Institution :
Lapp Insulator Co., Inc., Le Roy, New York, USA
fYear :
1965
Firstpage :
188
Lastpage :
191
Abstract :
1. ?Resiwrap? offers a solid insulation system with good thermal stability, high dynamie and static strengths, both through and between laminations, good temperature vs. power factor performance, relatively flat voltage vs. power factor curve and high di electric strength . 2. This resin-rich epoxy-impregnated paper material offers one of the few solid insulation systems that is void-free, has high corona inception voltages, low moisture absorption and high impermeability to gases and liquids. 3. The manufacturing process offers flexibility in application such as its use in condenser bushings. 4. All testing to date also demonstrates a long and dependable life. This material has had over five years of field experience in Europe, plus considerable development testing.
Keywords :
"Insulators","Resins","Temperature","Laminates","Resistance","Reactive power"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1965 Sixth
Print_ISBN :
978-1-5090-3105-4
Type :
conf
DOI :
10.1109/EIC.1965.7461223
Filename :
7461223
Link To Document :
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