DocumentCode
3771472
Title
Flame retardant synthetic fiber paper in molded circuitry
Author
G. R. Traut;R. C. Berry;P. L. Anderson
Author_Institution
Rogers Corporation
fYear
1963
Firstpage
42
Lastpage
43
Abstract
The major growth area within the printed circuit market is expected to be as a result of the development of flexible and multi-layer circuits. The continuing pressures on designers of electrical and electronic equipment for smaller and lighter packaging has greatly increased the demand for thin, multi-layer and flexible, wiring packages. In the automotive field, dashboard wiring is rapidly being replaced with flexible circuitry. Computer, appliance and meter manufacturers are among the many circuit users finding benefits in flexible multi-layer circuitry. Mechanical pattern generation methods lend themselves to the production of flexible circuits, where the insulating film to which the pattern is bonded is tough, flexible, and possesses good electrical properties.
Keywords
"Resins","Synthetic fibers","Resistance","Copper","Insulation","Encapsulation","Flame retardants"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference Materials and Application, 1963 EI
Print_ISBN
978-1-5090-3104-7
Type
conf
DOI
10.1109/EIC.1963.7461738
Filename
7461738
Link To Document