Title :
Embedment stresses — An inexpensive and direct test method
Author :
R. E. Isleifson;F. D. Swanson
Author_Institution :
Minneapolis Honeywell Reg. Co., Ordnance Division, Plastics Laboratory
Abstract :
Electronic devices embedded in resin are subject to stresses caused by chemical and thermal shrinkage of the resin. At low temperatures, stresses imparted to embedded components may be high enough to affect the performance of the device. A knowledge of the magnitude of these stresses is important in the selection of an embedment resin for a given application.
Keywords :
"Resins","Temperature measurement","Stress","Silicon compounds","Temperature distribution","Glass"
Conference_Titel :
Electrical Insulation Conference Materials and Application, 1963 EI
Print_ISBN :
978-1-5090-3104-7
DOI :
10.1109/EIC.1963.7461740
