DocumentCode :
3771573
Title :
New diallyl phthalate resins for low pressure molding encapsulation of electronic components
Author :
N. R. Segro;H. H. Beacham
Author_Institution :
FMC Corporation Organic Chemicals Division, Baltimore, Maryland
fYear :
1969
Firstpage :
98
Lastpage :
100
Abstract :
The allylic resins are well known among thermosets for their excellent electrical characteristics and in particular for their ability to retain these properties under adverse environmental conditions. Properties are little affected on prolonged exposure to high temperatures, moisture and aqueous and organic chemical media. Allylic resins are supplied commercially as prepolymers which, when filled with appropriate minerals and reinforcing fibers, serve as the basis for a series of molding compounds. They are also used as electrical, structural and decorative laminates.
Keywords :
"Compounds","Resins","Viscosity","Indexes","Encapsulation","Temperature measurement"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1969 9th
Print_ISBN :
978-1-5090-3108-5
Type :
conf
DOI :
10.1109/EIC.1969.7461841
Filename :
7461841
Link To Document :
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