Mechanical stresses induced on encapsulated components

The "cordwood" arrangement for packaging miniature components in a high-density array, appears to provide very little mechanical compliance and it has been suspected that under certain conditions relatively severe stresses might be produced on components, their leads, and connections. Considerable data have been published on the hydrostatic pressures induced within encapsulating materials,^1–7 but there seems to be no quantitative information on the stresses occurring in the components themselves.