Title :
Effects of humidity and heat aging on a new one-component silicone resin encapsulant
Author :
Allan R. Knivila
Author_Institution :
Dow Corning Corporation, Midland, Michigan
Abstract :
During the past year, a new one-part silicone resin encapsulant has been developed, characterized by a long pot life coupled with quick curing when heat is applied. "Open tank" pot life is about three months, and a shelf life of nine months or more at room temperature in storage. Curing times range from 30 minutes at 150°C to 240 minutes at 100°C, for sections i inch in thickness. These curing characteristics were developed to fill specific needs for an encapsulant which could be used in high volume, automated electronic packaging operations.
Keywords :
"Humidity","Testing","Aging","Curing","Conductivity","Heating","Ovens"
Conference_Titel :
Electrical Insulation Conference, 1969 9th
Print_ISBN :
978-1-5090-3108-5
DOI :
10.1109/EIC.1969.7461845