• DocumentCode
    3771577
  • Title

    Effects of humidity and heat aging on a new one-component silicone resin encapsulant

  • Author

    Allan R. Knivila

  • Author_Institution
    Dow Corning Corporation, Midland, Michigan
  • fYear
    1969
  • Firstpage
    111
  • Lastpage
    114
  • Abstract
    During the past year, a new one-part silicone resin encapsulant has been developed, characterized by a long pot life coupled with quick curing when heat is applied. "Open tank" pot life is about three months, and a shelf life of nine months or more at room temperature in storage. Curing times range from 30 minutes at 150°C to 240 minutes at 100°C, for sections i inch in thickness. These curing characteristics were developed to fill specific needs for an encapsulant which could be used in high volume, automated electronic packaging operations.
  • Keywords
    "Humidity","Testing","Aging","Curing","Conductivity","Heating","Ovens"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1969 9th
  • Print_ISBN
    978-1-5090-3108-5
  • Type

    conf

  • DOI
    10.1109/EIC.1969.7461845
  • Filename
    7461845