DocumentCode :
3771579
Title :
Packaging and environmental studies of copper clad tfe-glass stripline
Author :
J. H. Ball;Murray Olyphant;K. H. Zaininger
Author_Institution :
Minnesota Mining and Manufacturing Co., St. Paul, Minnesota
fYear :
1969
Firstpage :
119
Lastpage :
121
Abstract :
In microwave stripline devices circuit performance is directly dependent on the effective dielectric properties of the substrate. Variations in effective substrate properties in production, after thermal shock, with varying temperature, and as a result of moisture exposure can degrade circuit performance, change frequency response, and often render circuits inoperative.
Keywords :
"Films","Insulators","Integrated circuits","Substrates","Physics","Surface treatment","Stripline"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1969 9th
Print_ISBN :
978-1-5090-3108-5
Type :
conf
DOI :
10.1109/EIC.1969.7461847
Filename :
7461847
Link To Document :
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