Determination of dielectric thickness change in multilayer lamination

As the need for greater speed of electronic circuit operation accelerates, the determination of changes in the fabrication of multilayer interconnection boards (MIBs) becomes increasingly significant to the achievement of optimum circuit performance. Changes in the insulating layer thickness, for example, can affect design values such as those specified for: characteristic impedance of printed circuit conductor paths, signal pulse delay time, signal attenuation, built-in capacitance, and desired or undesired capacitive coupling within the printed circuits.