Title :
Metallization of beryllia ceramics for microelectronic use
Author_Institution :
Advanced Reliability Studies, General Electric Company, Syracuse, New York
Abstract :
Within the last decade and especially in the last two years, the use of beryllia as an electronic substrate material has risen dramatically. One reason for this has been the development of high power devices which require electrical isolation. Another reason has been the demand for high packaging densities. Both of these reflect a need to remove heat from the device efficiently.
Keywords :
"Substrates","Metallization","Ceramics","Surface morphology","Adhesives","Thick films"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1977 EIC 13th
Print_ISBN :
978-1-5090-3112-2
DOI :
10.1109/EIC.1977.7461916