DocumentCode :
3771646
Title :
Metallization of beryllia ceramics for microelectronic use
Author :
John A. DeVore
Author_Institution :
Advanced Reliability Studies, General Electric Company, Syracuse, New York
fYear :
1977
Firstpage :
70
Lastpage :
71
Abstract :
Within the last decade and especially in the last two years, the use of beryllia as an electronic substrate material has risen dramatically. One reason for this has been the development of high power devices which require electrical isolation. Another reason has been the demand for high packaging densities. Both of these reflect a need to remove heat from the device efficiently.
Keywords :
"Substrates","Metallization","Ceramics","Surface morphology","Adhesives","Thick films"
Publisher :
ieee
Conference_Titel :
Electrical/Electronics Insulation Conference, 1977 EIC 13th
Print_ISBN :
978-1-5090-3112-2
Type :
conf
DOI :
10.1109/EIC.1977.7461916
Filename :
7461916
Link To Document :
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