Adhesive systems in electronic assembly

Two new applications have been developed for use of adhesive systems in electronic assembly. The first application deals with the use of an advanced material to provide mechanical mounting to an output choke assembly while meeting the ferrite cores electromagnetic requirements. The second application provides electrical insulation, necessary mechanical bonding and thermal conduction path from power devices to the heat dissipating components. Both applications are cost-effective and reliable. This paper covers analysis of electromagnetic performance, stress analysis, heat transfer, vibration and shock response of the adhesive system. Experimental results of testing are presented and they correlate quite well with the calculations based on the theoretical model.