Title :
Thermal aspects of post-arc recovery dielectric strength of solid insulators
Author :
M.N. Kaplan;A.L. Tslaf
Author_Institution :
Electrical and Computer Engineering Department, Drexel University, Philadelphia, Pa. 19104, United States of America
fDate :
6/1/1984 12:00:00 AM
Abstract :
Thermal conditions in the track of an arc on a solid insulator are analyzed from the point of view of the recovery dielectric strength. It is shown quantitatively that feedback from the arc-track can delay the recovery of the residual arc column. Relationships to estimate the temperature diffusion from the “melted” arc-track are presented. These are compared with the temperature decay in the residual arc column. The power flow into the insulation body required for thermal analysis was determined experimentally.
Keywords :
"Plasma temperature","Temperature measurement","Insulators","Temperature distribution","Heating","Insulation life"
Conference_Titel :
Electrical Insulation, 1984 IEEE International Conference on
Print_ISBN :
978-1-5090-3124-5
DOI :
10.1109/EIC.1984.7465156