Title :
Micropackaging of electronic circuits
Author_Institution :
Canada Wire and Cable Technology Development Department, Noranda Research Centre, Pointe Claire, Quebec, Canada
Abstract :
During the past twenty-five years since the discovery of the transistor, the development of the semiconductor device technology has been very rapid. The availability of improved devices permitted the design and fabrication of new and more complex electronic circuits and systems which required new methods for assembly of the electronic components of these circuits.
Keywords :
"Substrates","Packaging","Resistors","Thick films","Integrated circuit interconnections","Production"
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
DOI :
10.1109/EIC.1973.7468681