DocumentCode :
3773254
Title :
Micropackaging of electronic circuits
Author :
R. D. Mcdonald
Author_Institution :
Canada Wire and Cable Technology Development Department, Noranda Research Centre, Pointe Claire, Quebec, Canada
fYear :
1973
Firstpage :
192
Lastpage :
193
Abstract :
During the past twenty-five years since the discovery of the transistor, the development of the semiconductor device technology has been very rapid. The availability of improved devices permitted the design and fabrication of new and more complex electronic circuits and systems which required new methods for assembly of the electronic components of these circuits.
Keywords :
"Substrates","Packaging","Resistors","Thick films","Integrated circuit interconnections","Production"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
Type :
conf
DOI :
10.1109/EIC.1973.7468681
Filename :
7468681
Link To Document :
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