DocumentCode :
3773255
Title :
Leadless packaging challenges the traditional dip
Author :
Stephen E. Grossman
Author_Institution :
Electronics Magazine, New York, New York
fYear :
1973
Firstpage :
194
Lastpage :
196
Abstract :
The dual in-line package has become the commonplace integrated circuit package of today-very much as the octal-based vacuum tube was a standard of yesterday. The dip, as it has come to be called, employs dual rows of leads which provide both the electrical interface and the mechanical retention. Each year better than one-half billion are manufactured and become active circuit components in all kinds of electronic equipment.
Keywords :
"Lead","Sockets","Gold","Packaging","Contacts","Substrates","Reliability"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
Type :
conf
DOI :
10.1109/EIC.1973.7468682
Filename :
7468682
Link To Document :
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